{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741609","patent":{"patent_number":"US-9741609","title":"Middle of line cobalt interconnection","assignee":null,"inventors":[],"filing_date":"2016-11-01T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method of fabricating features of a semiconductor device includes forming a contact over a substrate, the contact including a cobalt core and a liner layer arranged on sidewalls, wherein the contact includes a portion that is laterally surrounded by an interlevel dielectric (ILD); depositing another layer of ILD on the contact; etching a first opening in the ILD to expose a surface of the contact; removing the liner layer of the contact to expose a portion of the cobalt core; etching the ILD that laterally surrounds the contact to form a second opening beneath the first opening, the second opening having a width that is less than the first opening; depositing a liner on sidewalls of the first opening, the second opening, and directly on the cobalt core; and depositing a metal on the liner layer to form an interconnect structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Middle of line cobalt interconnection","description":"A method of fabricating features of a semiconductor device includes forming a contact over a substrate, the contact including a cobalt core and a liner layer arranged on sidewalls, wherein the contact","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741609","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741609","citation_suggestion":"Patentable. \"Middle of line cobalt interconnection\" (US-9741609). https://patentable.app/patents/US-9741609","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741609","json":"https://patentable.app/api/llm-context/US-9741609","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:08:24.768Z"}