{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741646","patent":{"patent_number":"US-9741646","title":"Package substrate and its fabrication method","assignee":null,"inventors":[],"filing_date":"2014-08-05T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate and its fabrication method","description":"This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plura","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741646","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741646","citation_suggestion":"Patentable. \"Package substrate and its fabrication method\" (US-9741646). https://patentable.app/patents/US-9741646","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741646","json":"https://patentable.app/api/llm-context/US-9741646","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:23:27.731Z"}