{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741647","patent":{"patent_number":"US-9741647","title":"Wiring substrate, semiconductor device, and method of manufacturing wiring substrate","assignee":null,"inventors":[],"filing_date":"2011-11-10T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A wiring substrate is provided with a first wiring layer including a first land, a first insulative layer formed on the first wiring layer, a second wiring layer formed on the first insulative layer, a second insulative layer formed on the second wiring layer, and a via formed extending through the first insulative layer and the second insulative layer in a thicknesswise direction. The via includes one end, which is electrically connected to the first land of the first wiring layer, and another end, which is located opposed to the one end and serves as a pad to which a mounted electronic component is electrically connected. The second wiring layer includes a coupling portion electrically connected to the via. The coupling portion of the second wiring has a width that is smaller than a diameter of the via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, semiconductor device, and method of manufacturing wiring substrate","description":"A wiring substrate is provided with a first wiring layer including a first land, a first insulative layer formed on the first wiring layer, a second wiring layer formed on the first insulative layer, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741647","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741647","citation_suggestion":"Patentable. \"Wiring substrate, semiconductor device, and method of manufacturing wiring substrate\" (US-9741647). https://patentable.app/patents/US-9741647","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741647","json":"https://patentable.app/api/llm-context/US-9741647","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T17:27:50.766Z"}