{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741652","patent":{"patent_number":"US-9741652","title":"Wiring substrate","assignee":null,"inventors":[],"filing_date":"2017-04-17T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A wiring substrate includes a wiring layer on a projection of an insulating layer. The wiring layer includes a first metal layer on an end face of the projection with a peripheral portion of the end face exposed, a second metal layer that is on the first metal layer and wider than the end face, and a third metal layer. The second metal layer includes first and second opposite surfaces with the second surface on the first metal layer with a peripheral portion thereof exposed. The third metal layer covers side surfaces of the first metal layer, and the first surface, the peripheral portion of the second surface, and side surfaces of the second metal layer, and fills in a region where the end face and the peripheral portion of the second surface face each other. The materials of the second and third metal layers are different."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate","description":"A wiring substrate includes a wiring layer on a projection of an insulating layer. The wiring layer includes a first metal layer on an end face of the projection with a peripheral portion of the end f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741652","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741652","citation_suggestion":"Patentable. \"Wiring substrate\" (US-9741652). https://patentable.app/patents/US-9741652","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741652","json":"https://patentable.app/api/llm-context/US-9741652","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:29:07.144Z"}