{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741676","patent":{"patent_number":"US-9741676","title":"Tin-indium based low temperature solder alloy","assignee":null,"inventors":[],"filing_date":"2016-06-24T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of copper (Cu), 0.1-0.5 wt. % of zinc (Zn), and a remainder of tin (Sn). In implementations, a sulfur compound may be included in a concentration of 100 ppm to 500 ppm in the alloy to prevent oxidation of zinc and indium on the surface of the alloy. The solder alloy is particularly useful for but not limited to solder on pad applications in first level interconnect semiconductor device packaging."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Tin-indium based low temperature solder alloy","description":"A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741676","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741676","citation_suggestion":"Patentable. \"Tin-indium based low temperature solder alloy\" (US-9741676). https://patentable.app/patents/US-9741676","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741676","json":"https://patentable.app/api/llm-context/US-9741676","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:17:28.600Z"}