{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9741691","patent":{"patent_number":"US-9741691","title":"Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)","assignee":null,"inventors":[],"filing_date":"2015-04-29T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"Systems and methods relate to power delivery networks (PDNs) for monolithic three-dimensional integrated circuits (3D-ICs). A monolithic 3D-IC includes a first die adjacent to and in contact with power/ground bumps. A second die is stacked on the first die, the second die separated from the power/ground bumps by the first die. One or more bypass power/ground vias and one or more monolithic inter-tier vias (MIVs) are configured to deliver power from the power/ground bumps to the second die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)","description":"Systems and methods relate to power delivery networks (PDNs) for monolithic three-dimensional integrated circuits (3D-ICs). A monolithic 3D-IC includes a first die adjacent to and in contact with powe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9741691","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9741691","citation_suggestion":"Patentable. \"Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)\" (US-9741691). https://patentable.app/patents/US-9741691","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9741691","json":"https://patentable.app/api/llm-context/US-9741691","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:18:59.102Z"}