{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9743554","patent":{"patent_number":"US-9743554","title":"Heat dissipation in electronics with a heat spreader","assignee":null,"inventors":[],"filing_date":"2015-11-18T00:00:00.000Z","publication_date":"2017-08-22T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":20,"abstract":"Heat dissipation configurations and methods are described herein. Certain electronic devices may include an individual piece of thermally conductive material having a first surface and a second surface. A first section of the thermally conductive material may be positioned between a motherboard and a backing layer of an electronic device such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is adjacent to the backing layer. A second section of the thermally conductive material may be positioned between a display module and a battery of the electronic device such that the first surface of the second section is adjacent to a back plate of the display module and the second surface of the second section is adjacent to the battery. The thermally conductive material may be configured to transfer heat between the first section and the second section."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat dissipation in electronics with a heat spreader","description":"Heat dissipation configurations and methods are described herein. Certain electronic devices may include an individual piece of thermally conductive material having a first surface and a second surfac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9743554","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9743554","citation_suggestion":"Patentable. \"Heat dissipation in electronics with a heat spreader\" (US-9743554). https://patentable.app/patents/US-9743554","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9743554","json":"https://patentable.app/api/llm-context/US-9743554","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:36:06.904Z"}