{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9748167","patent":{"patent_number":"US-9748167","title":"Silicon interposer, semiconductor package using the same, and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2016-07-25T00:00:00.000Z","publication_date":"2017-08-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"A silicon interposer includes a substrate having a frontside surface and a backside surface, a first redistribution layer (RDL) structure disposed on the frontside surface, a plurality of first connecting elements disposed on the first RDL structure, a second RDL structure disposed on the backside surface, a plurality of second connecting elements disposed on the second RDL structure, and a plurality of through silicon vias in the substrate to electrically connect the first RDL structure to the second RDL structure. The first connecting elements have a first pitch. The second connecting elements have a second pitch. The second pitch is greater than the first pitch."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Silicon interposer, semiconductor package using the same, and fabrication method thereof","description":"A silicon interposer includes a substrate having a frontside surface and a backside surface, a first redistribution layer (RDL) structure disposed on the frontside surface, a plurality of first connec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9748167","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9748167","citation_suggestion":"Patentable. \"Silicon interposer, semiconductor package using the same, and fabrication method thereof\" (US-9748167). https://patentable.app/patents/US-9748167","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9748167","json":"https://patentable.app/api/llm-context/US-9748167","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:57:09.817Z"}