{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9748201","patent":{"patent_number":"US-9748201","title":"Semiconductor packages including an interposer","assignee":null,"inventors":[],"filing_date":"2015-07-23T00:00:00.000Z","publication_date":"2017-08-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package may include a first semiconductor chip, second semiconductor chips disposed to respectively overlap with portions of the first semiconductor chip, a interposer disposed to overlap with a portion of the first semiconductor chip, and a package substrate disposed on backside surfaces of the second semiconductor chips opposite to the first semiconductor chip. The interposer may be disposed between the first semiconductor chip and the package substrate. First conductive coupling members connect the first semiconductor chip to the second semiconductor chips. Second conductive coupling members connect the first semiconductor chip to the interposer. Third conductive coupling members connect the interposer to the package substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including an interposer","description":"A semiconductor package may include a first semiconductor chip, second semiconductor chips disposed to respectively overlap with portions of the first semiconductor chip, a interposer disposed to over","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9748201","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9748201","citation_suggestion":"Patentable. \"Semiconductor packages including an interposer\" (US-9748201). https://patentable.app/patents/US-9748201","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9748201","json":"https://patentable.app/api/llm-context/US-9748201","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:04:34.555Z"}