{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9748217","patent":{"patent_number":"US-9748217","title":"Method of producing semiconductor device","assignee":null,"inventors":[],"filing_date":"2012-03-08T00:00:00.000Z","publication_date":"2017-08-29T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor device production method where separate semiconductor chips are stacked on a semiconductor substrate having a main surface on which multiple semiconductor chips including semiconductor integrated circuits are formed, the semiconductor chips in different layers are connected to each other to enable signal transmission, and a structure formed thereby is separated into multiple stacks of the semiconductor chips. The method includes a first step of forming an insulating layer on the main surface of the semiconductor substrate; a second step of stacking the separate semiconductor chips, which include the integrated semiconductor circuits on main surfaces thereof, via the insulating layer on the semiconductor chips formed on the semiconductor substrate such that opposite surfaces of the separate semiconductor chips opposite to the main surfaces face the insulating layer; and a third step of forming connecting parts that enable signal transmission between the semiconductor chips in different layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of producing semiconductor device","description":"A semiconductor device production method where separate semiconductor chips are stacked on a semiconductor substrate having a main surface on which multiple semiconductor chips including semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9748217","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9748217","citation_suggestion":"Patentable. \"Method of producing semiconductor device\" (US-9748217). https://patentable.app/patents/US-9748217","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9748217","json":"https://patentable.app/api/llm-context/US-9748217","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T20:45:43.519Z"}