{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9752247","patent":{"patent_number":"US-9752247","title":"Multi-layer encapsulated structures","assignee":null,"inventors":[],"filing_date":"2013-09-04T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["B33Y","H01L"],"num_claims":7,"abstract":"An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer encapsulated structures","description":"An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplatin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9752247","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9752247","citation_suggestion":"Patentable. \"Multi-layer encapsulated structures\" (US-9752247). https://patentable.app/patents/US-9752247","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9752247","json":"https://patentable.app/api/llm-context/US-9752247","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:14:22.548Z"}