{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9754805","patent":{"patent_number":"US-9754805","title":"Packaging method and structure","assignee":null,"inventors":[],"filing_date":"2016-02-25T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A system and method for manufacturing a semiconductor device are provided. In an embodiment a first semiconductor device and a second semiconductor device are encapsulated with an encapsulant. A dielectric layer is formed over the encapsulant, the first semiconductor device, and the second semiconductor device. The dielectric layer is planarized in order to reset the planarity of the dielectric layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging method and structure","description":"A system and method for manufacturing a semiconductor device are provided. In an embodiment a first semiconductor device and a second semiconductor device are encapsulated with an encapsulant. A diele","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9754805","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9754805","citation_suggestion":"Patentable. \"Packaging method and structure\" (US-9754805). https://patentable.app/patents/US-9754805","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9754805","json":"https://patentable.app/api/llm-context/US-9754805","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:04:04.910Z"}