{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9754849","patent":{"patent_number":"US-9754849","title":"Organic-inorganic hybrid structure for integrated circuit packages","assignee":null,"inventors":[],"filing_date":"2014-12-23T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Organic-inorganic hybrid structure for integrated circuit packages","description":"An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9754849","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9754849","citation_suggestion":"Patentable. \"Organic-inorganic hybrid structure for integrated circuit packages\" (US-9754849). https://patentable.app/patents/US-9754849","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9754849","json":"https://patentable.app/api/llm-context/US-9754849","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:57:22.013Z"}