{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9754898","patent":{"patent_number":"US-9754898","title":"Semiconductor package and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2013-06-20T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top surface of the interposer; a redistribution layer formed on the encapsulant and the top surface of the interposer; and at least a semiconductor element disposed on the redistribution layer. The top surface of the interposer is flush with a surface of the encapsulant so as for the redistribution layer to have a planar surface for disposing the semiconductor element, thereby preventing warpage of the interposer and improving the reliability of electrical connection between the redistribution layer and the semiconductor element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and fabrication method thereof","description":"A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9754898","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9754898","citation_suggestion":"Patentable. \"Semiconductor package and fabrication method thereof\" (US-9754898). https://patentable.app/patents/US-9754898","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9754898","json":"https://patentable.app/api/llm-context/US-9754898","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:38:39.617Z"}