{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9754900","patent":{"patent_number":"US-9754900","title":"Thermosetting adhesive sheet and semiconductor device manufacturing method","assignee":null,"inventors":[],"filing_date":"2016-05-24T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder and content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder; this thermosetting adhesive sheet is applied to a grinding-side surface of a semiconductor wafer and before dicing the semiconductor wafer. Printing using laser marking is thus made clear enabling excellent laser mark visibility and accurate alignment using infrared light."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermosetting adhesive sheet and semiconductor device manufacturing method","description":"A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparen","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9754900","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9754900","citation_suggestion":"Patentable. \"Thermosetting adhesive sheet and semiconductor device manufacturing method\" (US-9754900). https://patentable.app/patents/US-9754900","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9754900","json":"https://patentable.app/api/llm-context/US-9754900","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:39:15.239Z"}