{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9754922","patent":{"patent_number":"US-9754922","title":"3D integration using Al—Ge eutectic bond interconnect","assignee":null,"inventors":[],"filing_date":"2016-02-10T00:00:00.000Z","publication_date":"2017-09-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second CMOS wafer. The eutectic bond includes combinations where the eutectic bonding temperature is lower than the maximum temperature a CMOS circuit can withstand without being damaged during processing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"3D integration using Al—Ge eutectic bond interconnect","description":"Provided herein is an apparatus including a first CMOS wafer and a second CMOS wafer. A number of eutectic bonds connect the first CMOS wafer to the second CMOS wafer. The eutectic bond includes combi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9754922","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9754922","citation_suggestion":"Patentable. \"3D integration using Al—Ge eutectic bond interconnect\" (US-9754922). https://patentable.app/patents/US-9754922","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9754922","json":"https://patentable.app/api/llm-context/US-9754922","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:47:03.838Z"}