{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9758694","patent":{"patent_number":"US-9758694","title":"Curable resin composition, cured product thereof, and semiconductor device using the same","assignee":null,"inventors":[],"filing_date":"2016-01-26T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":56,"abstract":"According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Curable resin composition, cured product thereof, and semiconductor device using the same","description":"According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional group","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9758694","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9758694","citation_suggestion":"Patentable. \"Curable resin composition, cured product thereof, and semiconductor device using the same\" (US-9758694). https://patentable.app/patents/US-9758694","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9758694","json":"https://patentable.app/api/llm-context/US-9758694","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:16:37.525Z"}