{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9759766","patent":{"patent_number":"US-9759766","title":"Electromigration test structure for Cu barrier integrity and blech effect evaluations","assignee":null,"inventors":[],"filing_date":"2016-07-20T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"An electromigration test structure is provided for evaluation of interconnect liner integrity in a semiconductor interconnect structure. The electromigration test structure includes a feeding line; a stress line overlying the feeding line; a first via interconnecting the feeding line and the stress line, wherein the first via comprises a bottom barrier; a first cathode sense and a second cathode sense interconnected to the feeding line; and a first anode sense and a second anode sense interconnected to the feeding line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electromigration test structure for Cu barrier integrity and blech effect evaluations","description":"An electromigration test structure is provided for evaluation of interconnect liner integrity in a semiconductor interconnect structure. The electromigration test structure includes a feeding line; a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9759766","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9759766","citation_suggestion":"Patentable. \"Electromigration test structure for Cu barrier integrity and blech effect evaluations\" (US-9759766). https://patentable.app/patents/US-9759766","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9759766","json":"https://patentable.app/api/llm-context/US-9759766","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:37:00.067Z"}