{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9760670","patent":{"patent_number":"US-9760670","title":"Semiconductor device design methods and conductive bump pattern enhancement methods","assignee":null,"inventors":[],"filing_date":"2016-06-06T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","G06F","G06F","G06F","G06F","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Semiconductor device design methods and conductive bump pattern enhancement methods are disclosed. In some embodiments, a method of designing a semiconductor device includes designing a conductive bump pattern design, and implementing a conductive bump pattern enhancement algorithm on the conductive bump pattern design to create an enhanced conductive bump pattern design. A routing pattern is designed based on the enhanced conductive bump pattern design. A design rule checking (DRC) procedure is performed on the routing pattern."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device design methods and conductive bump pattern enhancement methods","description":"Semiconductor device design methods and conductive bump pattern enhancement methods are disclosed. In some embodiments, a method of designing a semiconductor device includes designing a conductive bum","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9760670","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9760670","citation_suggestion":"Patentable. \"Semiconductor device design methods and conductive bump pattern enhancement methods\" (US-9760670). https://patentable.app/patents/US-9760670","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9760670","json":"https://patentable.app/api/llm-context/US-9760670","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:31:22.450Z"}