{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761445","patent":{"patent_number":"US-9761445","title":"Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers","assignee":null,"inventors":[],"filing_date":"2016-03-28T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A method for providing a semiconductor structure includes: providing a structure having: layer comprising silicon, such as a layer of silicon or silicon carbide; a bonding structure; and silicon layer, the bonding structure being disposed between the layer comprising silicon and the silicon layer, the silicon layer being thicker than the layer comprising silicon; and, a Group III-V layer disposed on an upper surface of the layer comprising silicon; forming a Group III-V device in the III-V layer and a strip conductor connected to the device; removing silicon layer and the bonding structure to expose a bottom surface of layer comprising silicon; and forming a ground plane conductor on the exposed bottom surface of the layer comprising silicon to provide, with the strip conductor and the ground plane conductor, a microstrip transmission line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers","description":"A method for providing a semiconductor structure includes: providing a structure having: layer comprising silicon, such as a layer of silicon or silicon carbide; a bonding structure; and silicon layer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761445","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761445","citation_suggestion":"Patentable. \"Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers\" (US-9761445). https://patentable.app/patents/US-9761445","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761445","json":"https://patentable.app/api/llm-context/US-9761445","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:50:07.306Z"}