{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761510","patent":{"patent_number":"US-9761510","title":"Chip package and method for forming the same","assignee":null,"inventors":[],"filing_date":"2015-05-07T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":35,"abstract":"A chip package including a first device substrate is provided. The first device substrate is attached to a first surface of a second device substrate. A third device substrate is attached to a second surface of the second device substrate opposite to the first surface. An insulating layer covers the first, second and third device substrates and has at least one opening therein. At least one bump is disposed under a bottom of the opening. A redistribution layer is disposed on the insulating layer and electrically connected to the bump through the opening. A method for forming the chip package is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package and method for forming the same","description":"A chip package including a first device substrate is provided. The first device substrate is attached to a first surface of a second device substrate. A third device substrate is attached to a second ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761510","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761510","citation_suggestion":"Patentable. \"Chip package and method for forming the same\" (US-9761510). https://patentable.app/patents/US-9761510","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761510","json":"https://patentable.app/api/llm-context/US-9761510","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:50:02.294Z"}