{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761524","patent":{"patent_number":"US-9761524","title":"Metallization of the wafer edge for optimized electroplating performance on resistive substrates","assignee":null,"inventors":[],"filing_date":"2016-05-06T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region, wherein the substrate support is configured to rotate the substrate; a solution container configured to hold an electroless deposition solution; a dispenser configured to provide a flow of the electroless deposition solution; a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, to produce an increased thickness of the metallic material that reduces electrical resistance."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Metallization of the wafer edge for optimized electroplating performance on resistive substrates","description":"A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761524","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761524","citation_suggestion":"Patentable. \"Metallization of the wafer edge for optimized electroplating performance on resistive substrates\" (US-9761524). https://patentable.app/patents/US-9761524","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761524","json":"https://patentable.app/api/llm-context/US-9761524","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:45:50.318Z"}