{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761526","patent":{"patent_number":"US-9761526","title":"Interconnect structure having tungsten contact copper wiring","assignee":null,"inventors":[],"filing_date":"2016-02-03T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"Aspects of the present disclosure include interconnect structures for an integrated circuit (IC) structure and methods of making the same. The interconnect structures include one or more electronic devices formed on a substrate. A first interlevel dielectric (ILD) layer is over the one or more electronic devices. The interconnect structure includes a first trench in the first ILD layer. A tungsten contact fills the first trench and is in electrical contact with the one or more electronic devices. A second ILD layer is over the first ILD layer. The interconnect structure includes a second trench in the second ILD layer. Diffusion barrier liners bound all sides of the second trench except at a surface of the tungsten contact. The interconnect structure includes a copper wire filling the second trench, the copper wire in direct contact with the tungsten contact and with the diffusion barrier liners."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure having tungsten contact copper wiring","description":"Aspects of the present disclosure include interconnect structures for an integrated circuit (IC) structure and methods of making the same. The interconnect structures include one or more electronic de","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761526","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761526","citation_suggestion":"Patentable. \"Interconnect structure having tungsten contact copper wiring\" (US-9761526). https://patentable.app/patents/US-9761526","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761526","json":"https://patentable.app/api/llm-context/US-9761526","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:04:44.641Z"}