{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761542","patent":{"patent_number":"US-9761542","title":"Liquid metal flip chip devices","assignee":null,"inventors":[],"filing_date":"2016-09-07T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of the present invention provide an improved method and structure for flip chip implementation. The interconnections between the electronic circuit (e.g. silicon die) and the circuit board substrate are comprised of a metal alloy that becomes liquid at the operating temperature of the chip. This allows a softer underfill to be used, which in turn reduces stresses during operation and thermal cycling that are caused by the different coefficient of thermal expansion (CTE) of the electronic circuit chip and the circuit board substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Liquid metal flip chip devices","description":"Embodiments of the present invention provide an improved method and structure for flip chip implementation. The interconnections between the electronic circuit (e.g. silicon die) and the circuit board","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761542","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761542","citation_suggestion":"Patentable. \"Liquid metal flip chip devices\" (US-9761542). https://patentable.app/patents/US-9761542","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761542","json":"https://patentable.app/api/llm-context/US-9761542","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:30:36.519Z"}