{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761566","patent":{"patent_number":"US-9761566","title":"Multi-die structure and method of forming same","assignee":null,"inventors":[],"filing_date":"2016-04-13T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes forming a semiconductor device comprising a semiconductor die surrounded by a molding material, wherein a contact metal of the semiconductor device has an exposed edge, placing the semiconductor device into a tray having an inner wall and an outer wall, wherein the inner wall is underneath the semiconductor device and between an outer edge of the semiconductor device and an outer edge of bumps of the semiconductor device, depositing a metal shielding layer on the semiconductor device and the tray, wherein the metal shielding layer is in direct contact with the exposed edge of the contact metal and separating the semiconductor device from the tray."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-die structure and method of forming same","description":"A method includes forming a semiconductor device comprising a semiconductor die surrounded by a molding material, wherein a contact metal of the semiconductor device has an exposed edge, placing the s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761566","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761566","citation_suggestion":"Patentable. \"Multi-die structure and method of forming same\" (US-9761566). https://patentable.app/patents/US-9761566","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761566","json":"https://patentable.app/api/llm-context/US-9761566","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:04:44.824Z"}