{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761567","patent":{"patent_number":"US-9761567","title":"Power semiconductor module and composite module","assignee":null,"inventors":[],"filing_date":"2016-05-10T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power semiconductor module and composite module","description":"A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A res","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761567","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761567","citation_suggestion":"Patentable. \"Power semiconductor module and composite module\" (US-9761567). https://patentable.app/patents/US-9761567","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761567","json":"https://patentable.app/api/llm-context/US-9761567","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:14:56.784Z"}