{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9761583","patent":{"patent_number":"US-9761583","title":"Manufacturing of self aligned interconnection elements for 3D integrated circuits","assignee":null,"inventors":[],"filing_date":"2016-06-08T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method for making connection elements between two different levels of components in a 3D integrated circuit, including: forming a lateral insulating area supported on at least one given conducting area among several interconnection areas on a first level of components, the insulating area extending around a semiconducting layer on a second level in which at least one transistor can be formed; removing a first portion of the lateral insulating area so as to form at least one hole exposing said given conducting area; and depositing a conducting material in the hole so as to form a first electrical connection element between the second component and the given conducting area."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing of self aligned interconnection elements for 3D integrated circuits","description":"A method for making connection elements between two different levels of components in a 3D integrated circuit, including: forming a lateral insulating area supported on at least one given conducting a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9761583","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9761583","citation_suggestion":"Patentable. \"Manufacturing of self aligned interconnection elements for 3D integrated circuits\" (US-9761583). https://patentable.app/patents/US-9761583","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9761583","json":"https://patentable.app/api/llm-context/US-9761583","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:36:02.015Z"}