{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9762238","patent":{"patent_number":"US-9762238","title":"Systems and methods for supplying reference voltage to multiple die of different technologies in a package","assignee":null,"inventors":[],"filing_date":"2017-04-03T00:00:00.000Z","publication_date":"2017-09-12T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":20,"abstract":"A system in a package (SIP) has a first die with a first internal voltage level, first die-to-die output circuitry, first die-to-die input circuitry, and first internal logic and a second die with a second internal voltage level, second die-to-die output circuitry, second die-to-die input circuitry, and second internal logic. A first signal is provided to the second internal logic via the first die-to-die output circuitry and the second die-to-die input circuitry, wherein each of the first die-to-die output circuitry and second die-to-die input circuitry selectively level shift the first signal based on the first and second internal voltage levels. A second signal is provided to the first internal logic via the second die-to-die output circuitry and the first die-to-die input circuitry, wherein each of the second die-to-die output circuitry and first die-to-die input circuitry selectively level shift the second signal based on the first and second internal voltage levels."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems and methods for supplying reference voltage to multiple die of different technologies in a package","description":"A system in a package (SIP) has a first die with a first internal voltage level, first die-to-die output circuitry, first die-to-die input circuitry, and first internal logic and a second die with a s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9762238","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9762238","citation_suggestion":"Patentable. \"Systems and methods for supplying reference voltage to multiple die of different technologies in a package\" (US-9762238). https://patentable.app/patents/US-9762238","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9762238","json":"https://patentable.app/api/llm-context/US-9762238","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:51:46.983Z"}