{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9767833","patent":{"patent_number":"US-9767833","title":"Wire bonding electrical lapping guides for tape head module","assignee":null,"inventors":[],"filing_date":"2016-08-15T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["G11B","G11B","G11B","G11B","G11B","G11B","G11B","G11B","G11B","G11B","G11B"],"num_claims":20,"abstract":"A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wire bonding electrical lapping guides for tape head module","description":"A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape hea","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9767833","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9767833","citation_suggestion":"Patentable. \"Wire bonding electrical lapping guides for tape head module\" (US-9767833). https://patentable.app/patents/US-9767833","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9767833","json":"https://patentable.app/api/llm-context/US-9767833","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:08:07.839Z"}