{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768063","patent":{"patent_number":"US-9768063","title":"Dual damascene fill","assignee":null,"inventors":[],"filing_date":"2016-06-30T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of a dual damascene structure with trenches and vias is provided. A sealing layer of a first metal or metal alloy that has a low solubility with copper is selectively deposited directly on the copper containing interconnects in at bottoms of the vias, wherein sidewalls of the dielectric layer forming the vias are exposed to the depositing the sealing layer, and wherein the first metal or metal alloy that has a low solubility is selectively deposited to only form a layer on the copper containing interconnects. A via fill of a second metal or metal alloy that has a low solubility with copper is electrolessly deposited over the sealing layer, which fills the vias."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Dual damascene fill","description":"A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of a dual damas","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768063","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768063","citation_suggestion":"Patentable. \"Dual damascene fill\" (US-9768063). https://patentable.app/patents/US-9768063","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768063","json":"https://patentable.app/api/llm-context/US-9768063","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:36:19.094Z"}