{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768091","patent":{"patent_number":"US-9768091","title":"Method of forming an electronic package and structure","assignee":null,"inventors":[],"filing_date":"2012-02-29T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"In one embodiment, an electronic package structure includes multiple rows of I/O pads and is formed without a flag portion. An electronic device may be attached to a pair of adjacent inner rows of I/O pads. The pair of adjacent inner rows of I/O pads is configured to support, at least in part, the electronic device, and to receive connective structures, such as wire bonds. Connective structures may electrically connect the electronic device to the multiple rows of I/O pads, and an encapsulating layer covers portions of the I/O pads, the electronic device and the connective structures."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of forming an electronic package and structure","description":"In one embodiment, an electronic package structure includes multiple rows of I/O pads and is formed without a flag portion. An electronic device may be attached to a pair of adjacent inner rows of I/O","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768091","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768091","citation_suggestion":"Patentable. \"Method of forming an electronic package and structure\" (US-9768091). https://patentable.app/patents/US-9768091","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768091","json":"https://patentable.app/api/llm-context/US-9768091","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:58.328Z"}