{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768093","patent":{"patent_number":"US-9768093","title":"Resistive structure with enhanced thermal dissipation","assignee":null,"inventors":[],"filing_date":"2016-03-04T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An integrated circuit is provided. The integrated circuit includes a continuous resistor body having first and second distal terminals, and a group of electrically-floating dummy conductors that are formed above the continuous resistor body, and between the first and second distal terminals of the continuous resistor body. Each of the group of dummy conductors is coupled to the continuous resistor body through a respective via structure. The group of dummy conductors serves to dissipate heat for the continuous resistor body. If desired, an active conductor is interposed in the dummy conductors and serves as a center-tap for the continuous resistor body. The active conductor is connected to a contact node on the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resistive structure with enhanced thermal dissipation","description":"An integrated circuit is provided. The integrated circuit includes a continuous resistor body having first and second distal terminals, and a group of electrically-floating dummy conductors that are f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768093","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768093","citation_suggestion":"Patentable. \"Resistive structure with enhanced thermal dissipation\" (US-9768093). https://patentable.app/patents/US-9768093","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768093","json":"https://patentable.app/api/llm-context/US-9768093","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:19:33.697Z"}