{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768101","patent":{"patent_number":"US-9768101","title":"High density integrated circuit package structure and integrated circuit","assignee":null,"inventors":[],"filing_date":"2016-09-08T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B−8)×0.3 mm/2≦A1≦4.50 mm+(B−8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm≦A2≦3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3≧0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4≦B≦68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale. It may satisfy the requirements of low power consumption, high speed, large capacity and small volume for portable products."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High density integrated circuit package structure and integrated circuit","description":"The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768101","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768101","citation_suggestion":"Patentable. \"High density integrated circuit package structure and integrated circuit\" (US-9768101). https://patentable.app/patents/US-9768101","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768101","json":"https://patentable.app/api/llm-context/US-9768101","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:12:46.045Z"}