{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768105","patent":{"patent_number":"US-9768105","title":"Rigid interconnect structures in package-on-package assemblies","assignee":null,"inventors":[],"filing_date":"2012-04-20T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Rigid interconnect structures in package-on-package assemblies","description":"System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768105","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768105","citation_suggestion":"Patentable. \"Rigid interconnect structures in package-on-package assemblies\" (US-9768105). https://patentable.app/patents/US-9768105","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768105","json":"https://patentable.app/api/llm-context/US-9768105","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:26:05.828Z"}