{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768124","patent":{"patent_number":"US-9768124","title":"Semiconductor package in package","assignee":null,"inventors":[],"filing_date":"2016-09-11T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package having a second semiconductor package or module integrated therein. The semiconductor package of the present invention typically comprises active and passive devices which are each electrically connected to an underlying substrate. The substrate is configured to place such active and passive devices into electrical communication with contacts of the substrate disposed on a surface thereof opposite that to which the active and passive devices are mounted. The module of the semiconductor package resides within a complimentary opening disposed within the substrate thereof. The module and the active and passive devices of the semiconductor package are each fully or at least partially covered by a package body of the semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package in package","description":"A semiconductor package having a second semiconductor package or module integrated therein. The semiconductor package of the present invention typically comprises active and passive devices which are ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768124","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768124","citation_suggestion":"Patentable. \"Semiconductor package in package\" (US-9768124). https://patentable.app/patents/US-9768124","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768124","json":"https://patentable.app/api/llm-context/US-9768124","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:06.831Z"}