{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768136","patent":{"patent_number":"US-9768136","title":"Interconnect structure and method of fabricating same","assignee":null,"inventors":[],"filing_date":"2016-06-13T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed over a passivation layer of a substrate. A bump is formed over the PPI structure. A molding layer is formed over the PPI structure. A film is applied over the molding layer and the bump using a roller. The film is removed from over the molding layer and the bump, and the remaining material of the film on the molding layer forms the protective layer. A plasma cleaning is preformed to remove the remaining material of the film on the bump."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure and method of fabricating same","description":"An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed over a passivation layer of a substrate. A","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768136","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768136","citation_suggestion":"Patentable. \"Interconnect structure and method of fabricating same\" (US-9768136). https://patentable.app/patents/US-9768136","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768136","json":"https://patentable.app/api/llm-context/US-9768136","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:19:54.021Z"}