{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768154","patent":{"patent_number":"US-9768154","title":"Semiconductor package and manufacturing method therefor","assignee":null,"inventors":[],"filing_date":"2016-09-21T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold member formed on the main surface of the package substrate so as to cover the semiconductor devices, the mold member having an upper surface substantially parallel to the main surface of the package substrate; and an electromagnetic wave shield formed on the upper surface of the mold member. The mold member comprises a mold resin and metal magnetic particles dispersed in the mold resin. The metal magnetic particles are exposed to the upper surface of the mold member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method therefor","description":"Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768154","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768154","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method therefor\" (US-9768154). https://patentable.app/patents/US-9768154","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768154","json":"https://patentable.app/api/llm-context/US-9768154","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:17:09.222Z"}