{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9768780","patent":{"patent_number":"US-9768780","title":"Apparatus for providing shared reference device with metal line formed from metal layer with lower resistivity compared to other metal layers in processor","assignee":null,"inventors":[],"filing_date":"2014-05-30T00:00:00.000Z","publication_date":"2017-09-19T00:00:00.000Z","cpc_codes":["G06F","H04L"],"num_claims":18,"abstract":"Described is an apparatus which comprises: a reference device; and a processor having a plurality of circuit units, each circuit unit is operable to electronically couple with the reference device such that only one circuit unit of the plurality of circuit units is electronically coupled to the reference device at a given time while other circuit units of the plurality are electronically uncoupled to the reference device during that time."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatus for providing shared reference device with metal line formed from metal layer with lower resistivity compared to other metal layers in processor","description":"Described is an apparatus which comprises: a reference device; and a processor having a plurality of circuit units, each circuit unit is operable to electronically couple with the reference device suc","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9768780","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9768780","citation_suggestion":"Patentable. \"Apparatus for providing shared reference device with metal line formed from metal layer with lower resistivity compared to other metal layers in processor\" (US-9768780). https://patentable.app/patents/US-9768780","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9768780","json":"https://patentable.app/api/llm-context/US-9768780","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:36:36.837Z"}