{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773722","patent":{"patent_number":"US-9773722","title":"Semiconductor package with partial plating on contact side surfaces","assignee":null,"inventors":[],"filing_date":"2015-05-07T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of the present invention are directed to a semiconductor package with partial plating on contact surfaces. The semiconductor package includes a top surface, a bottom surface that is opposite the top surface, and side surfaces between the top surface and the bottom surface. Each of the side surfaces includes a step such that the area of the bottom surface is smaller than the area of the top surface. The semiconductor package includes a plurality of contacts that is located at peripheral edges of the bottom surface. Each of the plurality of contacts includes a first surface that is flush with the bottom surface, a second surface that is flush with one of the side surfaces, and a curved surface located at a corresponding step. In some embodiments, the first surface and the curved surface are plated, while the second surface is exposed (not plated)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with partial plating on contact side surfaces","description":"Embodiments of the present invention are directed to a semiconductor package with partial plating on contact surfaces. The semiconductor package includes a top surface, a bottom surface that is opposi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773722","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773722","citation_suggestion":"Patentable. \"Semiconductor package with partial plating on contact side surfaces\" (US-9773722). https://patentable.app/patents/US-9773722","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773722","json":"https://patentable.app/api/llm-context/US-9773722","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:21:02.626Z"}