{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773726","patent":{"patent_number":"US-9773726","title":"Three-dimensional integrated circuit integration","assignee":null,"inventors":[],"filing_date":"2016-11-03T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate vias to multiple bumps. A first current is directed from a first through-substrate via of a first electrical resistance through a first connection line to a first bump and directing a second current from the first through-substrate via through a second connection line of a second electrical resistance to a second bump. The first connection line has a first length relative to a first position of the first bump and a first cross-sectional area, the second connection line has a second length relative to a first position of the second bump and a second cross-sectional area, the second length is different from the first length, and the second cross-sectional area is different from the first cross-sectional area."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Three-dimensional integrated circuit integration","description":"Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate vias to multiple bumps. A first current is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773726","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773726","citation_suggestion":"Patentable. \"Three-dimensional integrated circuit integration\" (US-9773726). https://patentable.app/patents/US-9773726","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773726","json":"https://patentable.app/api/llm-context/US-9773726","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:35:43.258Z"}