{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773727","patent":{"patent_number":"US-9773727","title":"Multi-layer full dense mesh","assignee":null,"inventors":[],"filing_date":"2016-06-14T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A multi-layer full dense mesh (MFDM) device. The MFDM may include a metal-top layer including a bump pad array that may include a power1 (PWR1) bump pad within a PWR1 bump region, a VSS bump pad within a VSS bump region, and a power2 (PWR2) bump pad within a PWR2 bump region. The metal-top layer may also include a PWR1 majority metal-top region. The MFDM may also include a metal-top-1 layer beneath the metal-top layer and including a VSS majority metal-top-1 region, a PWR1 metal-top-1 region, and a PWR2 metal-top-1 region. The MFDM may also include a metal-top-2 layer beneath the metal-top-1 layer and including a PWR2 majority metal-top-2 region, a VSS metal-top-2 region, and a PWR1 metal-top-2 region. The MFDM may also include top-1 VIAs disposed between the metal-top layer and the metal-top-1 layer, and top-2 VIAs disposed between the metal-top-1 layer and the metal-top-2 layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer full dense mesh","description":"A multi-layer full dense mesh (MFDM) device. The MFDM may include a metal-top layer including a bump pad array that may include a power1 (PWR1) bump pad within a PWR1 bump region, a VSS bump pad withi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773727","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773727","citation_suggestion":"Patentable. \"Multi-layer full dense mesh\" (US-9773727). https://patentable.app/patents/US-9773727","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773727","json":"https://patentable.app/api/llm-context/US-9773727","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:04:59.886Z"}