{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773735","patent":{"patent_number":"US-9773735","title":"Geometry control in advanced interconnect structures","assignee":null,"inventors":[],"filing_date":"2016-08-16T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A via opening is provided in an interconnect dielectric material. Prior to line opening formation, a continuous layer of a sacrificial material is formed lining the entirety of the via opening. An organic planarization layer (OPL) and a photoresist that contains a line pattern are formed above the interconnect dielectric material. The line pattern is then transferred into an upper portion of the interconnect dielectric material, while maintaining a portion of the OPL and a portion of the continuous layer of sacrificial material within a lower portion of the via opening. The remaining portions of the OPL and the sacrificial material are then removed from the bottom portion of the via opening. A combined via opening/line opening is provided in which the via opening has a well controlled profile/geometry. An interconnect metal or metal alloy can then be formed into the combined via opening/line opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Geometry control in advanced interconnect structures","description":"A via opening is provided in an interconnect dielectric material. Prior to line opening formation, a continuous layer of a sacrificial material is formed lining the entirety of the via opening. An org","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773735","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773735","citation_suggestion":"Patentable. \"Geometry control in advanced interconnect structures\" (US-9773735). https://patentable.app/patents/US-9773735","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773735","json":"https://patentable.app/api/llm-context/US-9773735","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:02:34.374Z"}