{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773744","patent":{"patent_number":"US-9773744","title":"Solder bump cleaning before reflow","assignee":null,"inventors":[],"filing_date":"2011-07-12T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Generally, the subject matter disclosed herein relates to methods for forming modern sophisticated semiconductor devices, and more specifically, methods wherein substantially lead-free solder bumps may be formed above a contact layer of a semiconductor chip. One illustrative method disclosed herein includes forming a solder bump above a metallization layer of a semiconductor device, removing an oxide film from a surface of the solder bump, and, after removing the oxide film, performing a solder bump reflow process in a reducing ambient to reflow the solder bump."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder bump cleaning before reflow","description":"Generally, the subject matter disclosed herein relates to methods for forming modern sophisticated semiconductor devices, and more specifically, methods wherein substantially lead-free solder bumps ma","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773744","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773744","citation_suggestion":"Patentable. \"Solder bump cleaning before reflow\" (US-9773744). https://patentable.app/patents/US-9773744","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773744","json":"https://patentable.app/api/llm-context/US-9773744","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:29:16.488Z"}