{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773747","patent":{"patent_number":"US-9773747","title":"Wiring substrate and method for manufacturing wiring subtrate","assignee":null,"inventors":[],"filing_date":"2013-04-23T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A wiring substrate includes a core substrate. The core substrate includes a first surface, a second surface, and an opening extending through the core substrate between the first and second surfaces. A first conductive film is formed on the first surface and covers the opening. A second conductive film is formed on the second surface. The second conductive film covers the opening. An electronic component is arranged in the opening and connected to the first conductive film. An insulator fills the opening. A first wiring portion includes alternately stacked insulative layers and wiring layers and covers the first surface of the core substrate and the first conductive film. A second wiring portion includes alternately stacked insulative layers and wiring layers, and covers the second surface of the core substrate and the second conductive film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and method for manufacturing wiring subtrate","description":"A wiring substrate includes a core substrate. The core substrate includes a first surface, a second surface, and an opening extending through the core substrate between the first and second surfaces. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773747","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773747","citation_suggestion":"Patentable. \"Wiring substrate and method for manufacturing wiring subtrate\" (US-9773747). https://patentable.app/patents/US-9773747","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773747","json":"https://patentable.app/api/llm-context/US-9773747","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:41:47.730Z"}