{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773752","patent":{"patent_number":"US-9773752","title":"Printed circuit boards and semiconductor packages including the same","assignee":null,"inventors":[],"filing_date":"2016-07-27T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A printed circuit board (PCB) for reducing a size of a semiconductor package and a semiconductor package including the same are provided. The PCB includes a substrate base including a chip attach area disposed on a top thereof, a top pad and a bottom pad respectively disposed on the top and a bottom of the substrate base, a first top solder resist layer formed on the top of the substrate base and including a first pad opening corresponding to the top pad and covering the chip attach area, a second top solder resist layer formed on the first top solder resist layer and including a second pad opening corresponding to the top pad and a chip attach opening corresponding to the chip attach area, and a bottom solder resist layer formed on the bottom of the substrate base and including a third pad opening corresponding to the bottom pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed circuit boards and semiconductor packages including the same","description":"A printed circuit board (PCB) for reducing a size of a semiconductor package and a semiconductor package including the same are provided. The PCB includes a substrate base including a chip attach area","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773752","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773752","citation_suggestion":"Patentable. \"Printed circuit boards and semiconductor packages including the same\" (US-9773752). https://patentable.app/patents/US-9773752","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773752","json":"https://patentable.app/api/llm-context/US-9773752","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:26:09.524Z"}