{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773756","patent":{"patent_number":"US-9773756","title":"Semiconductor packages including molded stacked die with terrace-like edges","assignee":null,"inventors":[],"filing_date":"2016-03-25T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors may be disposed over a first surface of the first semiconductor die. The second semiconductor dies may be stacked over a second surface of the first semiconductor die. The mold layer may cover sidewalls of the second semiconductor dies. The outer packaging part may have a groove in which a stack structure of the first and second semiconductor dies are accommodated. The terrace-like edge may be disposed under an edge of the mold layer to expose a sidewall of the first semiconductor die. A portion of an outer sidewall of the mold layer may be in contact with a portion of an inner surface of the outer packaging part, and the inner surface of the outer packaging part may be spaced apart from the sidewall of the first semiconductor die by the terrace-like edge."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including molded stacked die with terrace-like edges","description":"A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a terrace-like edge. The external connectors m","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773756","citation_suggestion":"Patentable. \"Semiconductor packages including molded stacked die with terrace-like edges\" (US-9773756). https://patentable.app/patents/US-9773756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773756","json":"https://patentable.app/api/llm-context/US-9773756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:20:29.218Z"}