{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9773757","patent":{"patent_number":"US-9773757","title":"Devices, packaged semiconductor devices, and semiconductor device packaging methods","assignee":null,"inventors":[],"filing_date":"2016-05-03T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a device includes a first interconnect structure, a first integrated circuit die coupled to the first interconnect structure, and a second integrated circuit die disposed over and coupled to the first integrated circuit die. A second interconnect structure is disposed over the second integrated circuit die. First through-vias are coupled between the first interconnect structure and the second interconnect structure, and second through-vias are coupled between the first integrated circuit die and the second interconnect structure. A molding material is disposed around the first integrated circuit die, the second integrated circuit die, the plurality of first through-vias, and the plurality of second through-vias."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Devices, packaged semiconductor devices, and semiconductor device packaging methods","description":"Devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a device includes a first interconnect structure, a first integrated circuit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9773757","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9773757","citation_suggestion":"Patentable. \"Devices, packaged semiconductor devices, and semiconductor device packaging methods\" (US-9773757). https://patentable.app/patents/US-9773757","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9773757","json":"https://patentable.app/api/llm-context/US-9773757","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:02.664Z"}