{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9775229","patent":{"patent_number":"US-9775229","title":"Internally die-referenced thermal transfer plate","assignee":null,"inventors":[],"filing_date":"2017-01-25T00:00:00.000Z","publication_date":"2017-09-26T00:00:00.000Z","cpc_codes":["G06F","G06F","H01L","H01L","H01L"],"num_claims":20,"abstract":"This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive plate before transferring it across the interface. Surface area is a significant factor in TIM thermal performance, so this increases the performance substantially when using the same type of TIM pad. This device allows the use of lower performance TIM pads that resolve the issues of high die pressure and non-resilient behavior of high thermal conductivity TIMs. Additionally, the device mechanically isolates the SoC from the heatsink, which reduces stress and provides improved thermal performance."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Internally die-referenced thermal transfer plate","description":"This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive pla","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9775229","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9775229","citation_suggestion":"Patentable. \"Internally die-referenced thermal transfer plate\" (US-9775229). https://patentable.app/patents/US-9775229","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9775229","json":"https://patentable.app/api/llm-context/US-9775229","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:39:51.934Z"}