{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9779202","patent":{"patent_number":"US-9779202","title":"Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements","assignee":null,"inventors":[],"filing_date":"2015-09-28T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F"],"num_claims":17,"abstract":"Systems and methods to detect, quantify, and control process-induced asymmetric signatures using patterned wafer geometry measurements are disclosed. The system may include a geometry measurement tool configured to obtain a first set of wafer geometry measurements of the wafer prior to the wafer undergoing a fabrication process and to obtain a second set of wafer geometry measurements of the wafer after the fabrication process. The system may also include a processor in communication with the geometry measurement tool. The processor may be configured to: calculate a geometry-change map based on the first set of wafer geometry measurements and the second set of wafer geometry measurements; analyze the geometry-change map to detect an asymmetric component induced to wafer geometry by the fabrication process; and estimate an asymmetric overlay error induced by the fabrication process based on the asymmetric component detected in wafer geometry."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements","description":"Systems and methods to detect, quantify, and control process-induced asymmetric signatures using patterned wafer geometry measurements are disclosed. The system may include a geometry measurement tool","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9779202","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9779202","citation_suggestion":"Patentable. \"Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements\" (US-9779202). https://patentable.app/patents/US-9779202","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9779202","json":"https://patentable.app/api/llm-context/US-9779202","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:04:00.660Z"}