{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9779968","patent":{"patent_number":"US-9779968","title":"Method for processing semiconductor substrate and method for manufacturing semiconductor device in which said processing method is used","assignee":null,"inventors":[],"filing_date":"2016-03-08T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"Provided are a method of processing a semiconductor substrate and a method of manufacturing a semiconductor device that uses this method of processing. The method of processing the semiconductor substrate includes: a bonding step in which a supporting plate, which is composed primarily of a material that substantially transmits laser light of prescribed wavelength, and a principal surface of a semiconductor substrate, which is composed primarily of a material that substantially transmits the laser light of the prescribed wavelength, are arranged to face each other in a vacuum and then pressed together in the vacuum with an intermediate layer that includes an amorphous silicon layer interposed therebetween; and a separating step in which, after the laser light is radiated from a side of the supporting plate and the intermediate layer absorbs laser energy, the semiconductor substrate and the supporting plate are separated from each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for processing semiconductor substrate and method for manufacturing semiconductor device in which said processing method is used","description":"Provided are a method of processing a semiconductor substrate and a method of manufacturing a semiconductor device that uses this method of processing. The method of processing the semiconductor subst","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9779968","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9779968","citation_suggestion":"Patentable. \"Method for processing semiconductor substrate and method for manufacturing semiconductor device in which said processing method is used\" (US-9779968). https://patentable.app/patents/US-9779968","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9779968","json":"https://patentable.app/api/llm-context/US-9779968","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:41.288Z"}